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iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging

04/26/2024 | iNEMI
Advanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.

HCLTech Launches EDA Solution Powered by NetApp to Accelerate EDA Workloads in the Cloud

04/11/2024 | HCLTech
HCLTech, a leading global technology company, announced the launch of an Electronic Design Automation (EDA) solution in partnership with NetApp, to enable enterprises in the semiconductor industry to accelerate large EDA implementations in the hybrid cloud to significantly reduce their time-to-market, enhance the overall quality and improve the reliability of their products.

Cadence Continues ‘Left Shift’ of SI Functions 

02/29/2024 | I-Connect007 Editorial Team
At DesignCon, the I-Connect007 Editorial Team met with Brad Griffin, product marketing group director for the System Analysis Group at Cadence Design Systems. Brad explains how this analysis tool enables designers to address SI and PI issues early in the design process, before they become costly errors, and why he believes his late co-worker Dennis Nagel would be proud to see his efforts come to fruition. 

Keysight, Intel Foundry Partner to Certify Electromagnetic Simulation Software for Intel 18A Process Technology

02/22/2024 | BUSINESS WIRE
Keysight Technologies, Inc. announces that the RFPro electromagnetic (EM) simulation software, part of the Keysight EDA Advanced Design System (ADS) integrated tool suite, is now certified by Intel Foundry for design engineers targeting Intel 18A process technology.

Beyond Design: Embedded Capacitance Material

02/22/2024 | Barry Olney -- Column: Beyond Design
Embedding components into the multilayer PCB substrate can have many benefits, including reduced board size and improved signal integrity. However, embedded capacitance material (which is not really a component but rather part of the substrate) can improve power integrity dramatically by reducing AC impedance and generally enhancing the performance of the product. It takes up no additional space, is easy to implement (because it is compatible with standard FR-4 processes), and can be cost-effective.
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