Welcome to I-007eBooks. Below you’ll find our comprehensive library of books written by industry experts on a variety of important topics. Peer-reviewed by topic specialists, I-007eBooks are the gold standard for technical education in the circuit board industry. Download your favorite title(s) free!
Review from Richard Coyle, Consulting Member of Technical Staff, Nokia Bell Labs
"Readers will find this book provides technical insights into the ever-evolving challenges of the assembly and reliability of low-temperature solder alloys. This second volume includes updates on fourth-generation low-temperature solders and a preview of the capabilities of ultra-low temperature (ULT) solders."
Review from Jason Sciberras, President, Saline Lectronics Division of Emerald Technologies
"I would recommend that any data-driven engineers focused on taking their manufacturing operations to the next level read this book."
Review from Dr. Helmut Schweigart, Head of Reliablility & Surfaces, Zestron Europe.
"Readers will learn the advantages and disadvantages of different encapsulation materials and the importance of the application process. In order to find the right balance between benefit and effort, the author suggests using analytical approaches to configure the process and its settings. Additionally, she is always conscious of the need for sustainability when it comes to electronic assemblies."
Review from Ammar Abusham, DFM Integration Engineer (AR EE Team), Meta Reality Labs
"This book effectively addresses the need for early integration of manufacturing elements into the design process. In an industry racing against time, MDD is the key to staying ahead.
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Review from Michael Ford, Senior Director Emerging Industry Strategy, Aegis Software
"This book provides unprecedented visibility of SMT processes, asserting inspection technology as a key active contributor to zero-defect quality initiatives, rather than being limited to simple defect detection."
Review from Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH
"A must-read for everyone who wants to deal responsibly with the subject of humidity robustness and electrochemical reliability of electronics with the now new, valid state of the art for material and process qualification.
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Review from Dan Beaulieu
"A "must-have" guidebook for everyone involved in Flex technology."
Review from Duane Benson, Director of Marketing, Screaming Circuits
"I find that having a better understanding of the underlying process helps me create higher quality electronic designs. In this book, Matt Stevenson does a fantastic job of opening up the hood and giving the reader that knowledge of the PC board fab process."
Review from Nick Niculita, Engineering Manager, SRXGlobal
"This book is a must-read for everybody who wants to improve the overall design-through-manufacturing NPI phase and ultimately do more with less, the Holy Grail of any manufacturer."
Review from Kyle Burk, PhD, President and Director of Engineering for KBJ Engineering, LLC
"This textbook is a great addition and supplement to the first edition. It delves deeper into the science of insulated metal substrates and their useful, often overlooked, properties for proper thermal management."
Review from Binayak Shrestha, Senior Research Engineer at C-DOT
"The most important aspect in the whole design process is getting the stackup correct. This book is one such rare gem which consolidates all the information in one single place!"
Review from Mark Thompson, Engineering Manager, Out of the Box
"I love this book. Particularly the sections on the effects of the glass weave, the history of laminate, and the difference between Dk and Effective Dk. I highly recommend this book for any designer or engineer looking to better understand laminate!"
Review from Joe O'Neil, Principal, OAA Ventures
"The Printed Circuit Assembler’s Guide to Solder Defects is an outstanding summary of the how’s and why’s of paste theory, defect causation and recommended best practices. This short read contains real world advice from the experts. I highly recommend it for anyone involved in the PCB Assembly process."
Review from Lee Ritchey, Founder and President, Speeding Edge
"Author Brad Griffin offers readers a very good explanation of system-level analysis of complex and high-speed electronic designs. I highly recommend this book for those who are getting started with the design of PCBs and systems that are used in data centers."
Review from Marius Stepanescu, Technical Director, ICCO EMT
"The Printed Circuit Assembler's Guide to... Smart Data explains the role of data acquisition and analytics in Industry 4.0. This book provides a very good description of the main challenges of collecting and handling smart data and analyzing it in the proper way."
Review from Dan Beaulieu, President, DB Management Group
"For those who are, shall we say, 'less technical' than others, it’s refreshing—not to mention face-saving, at times—to be able to understand terms like insulated metal-clad PCBs (IMPCBs), metal-clad PCBs (MCPCBs) and mixed-technology PCBs."
Review from Mike Cummings, Technical Director, TSI
"Well-written and easy to follow, this dedicated book focuses on the importance of cleaning and decontamination of electronic circuits before application. This topic is timely and important, considering the increasing importance of high-reliability electronics, security, and safety in an increasingly connected world.
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Review from Happy Holden, Consulting Technical Editor, I-Connect007
"This is essential reading for those who are wondering, "What can smart factories do for me?" The Mentor/Siemens description of how Industry 4.0 can benefit an electronics manufacturer, and how to go about using such a concept, is both detailed and easy to understand. It is one of the best books on the subject!"
Review from Kelly Dack, CIT, CID+ PCB Designer, Instructor & Manufacturing Liaison
"This book explains how information embedded in a PCB design layout database can be leveraged to efficiently and dynamically output more accurate PCB design documentation."
Review from Stephen V. Chavez, IPC Designers Council
"This is a great resource for those who wish to gain a better understanding of all that it takes to design a complex PCB/CCA in today’s ever-evolving industry. For a designer, challenges always include layout solvability, electrical integrity, and manufacturability. The goal is making revision one work. I refer to this as ‘The Designer’s Triangle’."
Review from Alex Stepinski, vice president, GreenSource Fabrication
"Happy takes a textbook-style approach using easy-to-follow language. He provides step-by-step points for the DIYer, especially for making your own chemistry controllers, while providing examples from his past experiences.
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Review from Dan Beaulieu, president, D.B. Management
"If you are serious about creating the best, most perfect data packages available today, do yourself a favor. Download and read this book. It’s simple—the better the package, the better the board.
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Review from Happy Holden, Consulting Technical Editor, I-Connect007
"I found this book to be very educational and informative. I agree with the authors that there are many advantages to using an LMP solder paste when it comes to improving the assembly and field reliability of complex HDI structures. I was particularly interested in their look at advanced density packaging for PoP and SiP, as these are rising packaging trends."
Review from Andy Shaughnessy, Managing Editor, Design007 Magazine
"This book will help the reader gain a comprehensive understanding of the physical realities of insulated metal substrates and their applications in the thermal management of electronic assemblies."
Review from Darren Smith, founding principal at AthenaTech
"A very thorough how-to that informs and enhances your project's ROI. Critical for designers new to RF layout or combining multiple impedance environments."
Review from Gene Garat, President, Moss Bay EDA
"Engineers new to the field as well as career veterans can all benefit from this quick read, well-illustrated with plenty of examples."
Review from Dr. Helmut Schweigart, Technology Development Head, Zestron Europe.
"This micro eBook offers a comfortable approach to the selection, implementation, and testing of protective coating processes. It would be especially helpful for starters to use as a checklist for operational implementation."
Review from Eric Bogatin
"If you care about signal integrity, you are sure to pick up a few nuggets of insight from this new eBook."
Review from Happy Holden
"Martyn Gaudion of Polar has taken the extremely complex topic of signal integrity and provided an easy to understand explanation of this phenomena. I encourage everyone to download and read this engaging e-book."
Review from Dan Beaulieu
"Joe Fjelstad does a great job of explaining the ins and outs of this process, as well as the numerous prospective advantages and some possible caveats.
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Review from Eric Bogatin
"The Printed Circuit Designer's Guide to... Secrets of High-Speed PCBs, Part 1 pulls back the covers to illustrate the practical principles behind many of the confusing topics that arise in the overlap between manufacturing, materials, and signal integrity performance."
Review from Andy Shaughnessy
"There are plenty of PCB books available now, but not many focus on DFM. Altium’s new e-book, The Printed Circuit Designer's Guide to...Design for Manufacturing (DFM), has everything you need to know to get your board ‘right the first time."
Review from Dan Beaulieu
"This book is long overdue. Finally, a book on AS9100 certification written in clear and concise language.""