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Laser Photonics Completes Proof of Concept Testing for Fonon Corporations' Laser Shield Anti-Drone System

06/06/2024 | BUSINESS WIRE
Laser Photonics Corporation (LPC), a leading global industrial developer of laser systems for cleaning and other material processing applications, and its parent company, Fonon Corporation, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and additive manufacturing, have announced the successful early testing of Fonon's Laser Shield Anti-Drone System (LSAD) prototype at LPC's testing facility.

Foxconn to Build Advanced Computing Center in Taiwan Based on NVIDIA Blackwell Platform

06/05/2024 | PRNewswire
Hon Hai Technology Group (Foxconn) announced that it plans to build an advanced computing center in Kaohsiung, Taiwan, with the NVIDIA Blackwell platform at its core, as the CEOs of the two technology bellwethers reaffirmed their strong partnership at COMPUTEX 2024.

Samsung Reportedly Achieves Technical Breakthrough, Stacking 3D DRAM to 16 Layers

06/05/2024 | PRNewswire
According to the news report from DIGITIMES Asia, Samsung Electronics has successfully stacked the next-gen 3D DRAM to 16 layers, twice as many as its competitor Micron.

Advancing PCB Technology: A Conversation With John Johnson

06/04/2024 | Barry Matties, Publisher, I-Connect007
John Johnson, an industry veteran with 45 years of experience, shares insights on the adoption of the Averatek process at American Standard Circuits, highlights the shift toward finer lines and spaces in PCB manufacturing, and emphasizes the importance of technology, cleanliness, and material adhesion in achieving ultra-fine lines. He addresses the challenges in advancements of the additive process, emphasizing the need for a mindset shift and employee training.

Koh Young at SEMICON West with a Focus on Inspection & Metrology for Semiconductor and Advanced Packaging Challenges

06/04/2024 | Koh Young
Koh Young, the industry leader in True3D measurement-based inspection solutions, will demonstrate its ZenStar and Meister Series of automated inspection and metrology tools for semiconductor and advanced package applications in booth 1833 at SEMICON West, taking place from July 9-11, 2024, at the Moscone Center in San Francisco, CA.
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