Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

SiPearl: Partnership with Samsung Electronics for built-in HBM in Rhea

05/14/2024 | BUSINESS WIRE
SiPearl, the company building the high-performance low-power European microprocessor for HPC and AI inference, has signed a partnership with Samsung Electronics Co. Ltd., a world leader in advanced memory technology, to equip its Rhea series with Samsung’s advanced memory solution ideal for HPC and AI applications.

MerlinTPS Partners with Bluespec to Provide Urgently Needed GPS Augmentation and Backup Without Satellites

05/14/2024 | Globe Newswire
This collaboration enables the two companies to bring to life the next phase of MerlinTPS’ next-gen platform, which is capable of providing positioning, navigation, timing (PNT) and geospatial radio frequency data.

KYZEN to Showcase Advanced Packaging Solutions at PCIM Europe 2024

05/14/2024 | KYZEN'
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is excited to announce its participation in PCIM Europe 2024, scheduled to take place June 11-13, 2024 in Nuremberg, Germany.

LPKF is Ready for Increasing Demand for Glass Substrates in the Semiconductor Industry

05/13/2024 | LPKF
The semiconductor industry is shifting towards glass to package the most advanced semiconductor chips. LPKF’s mature LIDE technology is enabling that transition into this new era from ramp-up to high volume manufacturing.

IDENTCO Highlights Automation Capabilities and PCB Labeling at PCB East

05/13/2024 | IDENTCO
IDENTCO – a manufacturer of high-performance labeling solutions for the power equipment, electronics, transportation, and general industrial sector – will highlight its automation capabilities and PCB labeling solutions at PCB East, June 4-7 in Boxborough, MA, Booth #301.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in