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Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
February 23, 2024 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes
It’s not spring, but we must be getting close. It was 70 yesterday here in Atlanta, and I was able to wear a Hawaiian shirt, shorts, and sandals for the first time this year. If you’re wearing a Hawaiian shirt, you know it’s going to be a good day.
It was a good week in PCB design and manufacturing as well. In this week’s wrap-up, we have news about an uptick in EMS shipments in January, a look at the current M&A climate, some guidance on investing in your company in order to stay competitive, a primer on designing with embedded capacitance materials, and a roadmap for the industry to embrace sustainable PCBs in the future.
As many of you have told me at recent trade shows, it's a good time to be in this industry. Have a good weekend!
Catching Up With Industry M&A Expert Tom Kastner of GP Ventures
Published February 21
Dan Beaulieu recently interviewed Tom Kastner, our resident mergers and acquisitions expert. Here they discuss the current M&A climate, and whether CFIUS (the Committee on Foreign Investment in the United States) regulations prohibit Chinese companies from acquiring U.S. tech companies. (Apparently, yes.) Check it out.
Standard of Excellence: Moving Into the Future by Growing Your Technology
Published February 21
Is your company growing every day? As columnist Anaya Vardya points out here, in this industry, if you’re not growing, you’re dying. In this column, Anaya discusses the need for fabricators to invest in their businesses, and he lays out a roadmap for this investment as well.
Beyond Design: Embedded Capacitance Material
Published February 22
More and more designers are working with embedded components. If you’re considering moving into this arena, you probably have a lot of questions. In this column, Barry Olney addresses many of your concerns about embedded, particularly regarding signal integrity and embedded capacitance materials. On the plus side, embedding components often provides better signal integrity.
North American EMS Industry Up 2.6% in January 2024
Published February 23
Our industry seems to be in a pretty good spot right now. At trade shows, company managers from all sectors tell me that they’re optimistic about the rest of 2024, and this news backs up that confidence. With North American EMS shipments up 2.6% over the same period last year, things are looking good.
Recycling PCBs: How NCAB is Navigating Challenges and Embracing Opportunities
Published February 22
There’s been a lot of talk about sustainability in this industry, and each year we see more environmental regulations designed to steer manufacturers into producing sustainable PCBs. But as Jan Pedersen points out, regulations alone won’t get the job done. In this article, Jan discusses some of the technologies that he believes will lead us into a world of fully recyclable PCBs.
Suggested Items
Real Time with… IPC APEX EXPO 2024: The Success and Future of IPS's Vertical Technology
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ASMC 2024 Opens With AI, Smart Manufacturing and Sustainability in Focus
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AEye Announces Partnership with Leading Automotive Electronics and Vision Solutions Provider, LITEON
05/13/2024 | BUSINESS WIREAEye, Inc., a global leader in adaptive, high-performance lidar solutions, today announced that the non-binding Letter of Intent (“LOI”) announced in March is with LITEON Technology Corporation and is intended to provide AEye with a customer channel and industrialization partnership.
DuPont Showcases AI Innovations Featuring Advanced Interconnects at 2024 International Electronic Circuits Exhibition
05/13/2024 | DuPontDuPont announced it will showcase its comprehensive range of advanced circuit materials and solutions at the 2024 International Electronic Circuits Exhibition in Shanghai. With a product portfolio that includes fine line, signal integrity, power and thermal management, DuPont will exhibit at Booth #8L06 at the National Exhibition and Convention Center (NECC) from May 13 to 15.
Korean Semiconductor Industry Titans Back DEEPX in Series C Funding Round
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