Printed Circuits, a fast-growing printed circuit board fabricator, offers excellent opportunities for advancement and growth in a dynamic manufacturing environment full of state-of-the-art manufacturing equipment. 

Benefits also include:

• Excellent health, dental and other benefits
• Annual profit-sharing plan
• Signing bonus
• Additional incentives at the leadership level
• Highly collaborative corporate and manufacturing culture that values employee contributions

Nature of Duties/Responsibilities

• Layup cover lay
• Layup rigid flex
• Layup multilayer/CU core boards
• Oxide treat/cobra treatment of all layers/CU cores
• Shear flex layer edges
• Rout of machine panel edges and buff
• Remove oxide/cobra treatment (strip panels)
• Serialize panels
• Pre-tac Kapton windows on flex layers (bikini process)
• Layup Kapton bonds
• Prep materials: B-stage, Kapton, release sheet
• Breakdown: flex layers, and caps
• Power scrub: boards, layers, and caps
• Laminate insulators, stiffeners, and heatsinks
• Plasma cleans and dry flex layers B-stage (Dry)
• Booking layers and materials, ready for lamination process
• Other duties as deemed necessary by supervisor

Education/Experience

• High school diploma or GED
• Must be a team player
• Must demonstrate the ability to read and write English and complete simple mathematical equations
• Must be able to follow strict policy and OSHA guidelines
• Must be able to lift 50 lbs
• Must have attention to detail

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