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Intel Brings AI-Platform Innovation to Life at the Olympic Games

04/18/2024 | BUSINESS WIRE
Intel announced its plans for the Olympic and Paralympic Games Paris 2024. Bringing AI Everywhere, Intel will implement artificial intelligence technology powered by Intel processors on the world’s biggest stage.

The Connection Between Wire Harness and Box Build

04/17/2024 | Nolan Johnson, I-Connect007
Christina Rutherford is a technical lead and expert in materials engineering at Honeywell, where her specialty is the design, specification, and manufacture of cables and wire harnesses. Rutherford also sits on the committee for IPC/WHMA-A-620. In this conversation, we explore the changing dynamics in wire harnesses and how they relate to box build. Christina’s standards work allows her to draw insightful parallels between wire harness and box build.

Real Time with... IPC APEX EXPO 2024: Innovations in Thermal, Warpage, and Strain Metrology

04/17/2024 | Real Time with...IPC APEX EXPO
Editor Nolan Johnson talks with Neil Hubble, president of Akrometrix, about the company's leadership in thermal, warpage, and strain metrology. Neil details how Akrometrix is committed to addressing customer challenges through technological evolution, innovative solutions, and a focus on data processing. A tabletop unit for thermal warpage testing is showcased at IPC APEX EXPO this year.

Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper

04/17/2024 | Hentec Industries/RPS Automation
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality. 

Connect the Dots: Designing for Reality: Prioritizing Manufacturability

04/11/2024 | Matt Stevenson -- Column: Connect the Dots
Realistic PCB designs should prioritize manufacturability and reliability of the PCB as well as meet the other design requirements. To do so, one must account for the production variables associated with individual manufacturing partners. Understanding and creating robust PCB designs, especially in terms of board manufacturing, requires a lot of attention to detail. When more detail is included in the design, the manufacturing process goes more smoothly, and process yields are higher.
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